More than Moore’s Law: Innovation in the Semiconductor World with Additive Manufacturing.
Additive manufacturing (AM) techniques such as inkjet printing and 3D printing have emerged as low cost, high performance technologies for electronics fabrication. Initial applications cover sensors, antennas, frontends, and packages for systems from DC to millimeter wave frequencies. This research, though, has been heavily dominated by the academic industry. This is due to manufacturing limitations in accuracy, precision, throughput and yield ultimately limiting mass production. Despite this, a few applications for printed electronics have been demonstrated in a commercial space (e.g. printed OLED fabrication), but ultimately the impact has been restricted. It is at this time though that the technology has finally reached a point where it is robust enough for mass manufacturing in the microelectronics commercial space. This presentation will provide insight into the applications, challenges, and benefits of AM in the semiconductor space.
Texas Instruments (TI) has begun to investigate the role AM will play in the future of the semiconductor/integrated circuit (IC) industry. A wide variety of applications are being studied with a promising subset to fall under what is collectively known as “semiconductor packaging” (SCP). Investigations and developments using inkjet, material extrusion, and vat photopolymerization have been performed at varying technology readiness levels (TRL) in the commercial and also academic space. These applications range from wafer to package level with challenges and benefits unique to each level being identified and addressed. Such major issues include massive parallelization of AM, reproducibility/reliability on a micron scale, and novel materials qualification in a large industrial pipeline. Benefits include selective deposition, multi-material capabilities, flexible manufacturing tools and a massive reduction in material waste. Each innovative attempt brings significant potential to affect how TI approaches the semiconductor market and offer unique benefits in their respective domains.
Texas Instruments, as one of the world’s leading semiconductor design and manufacturing companies, is driven to be competitive by reducing cost and innovating in the semiconductor space. TI relies on staying ahead of the curve to maintain its reputation as an industry leader and to compete in the crowded landscape of electronics. AM for printed electronics is a key technology and primary target for TI due to the novel applications AM enables. Through AM, TI intends on expanding its current markets and creating completely new ones for the microelectronics industry, leading the way in printed IC technology.
Daniel Revier is passionate about bringing the paradigm shift of additive manufacturing (AM) to the printed electronics world. As the Lead Engineer of Texas Instruments’ (TI) Printed Electronics Research Laboratory (PERL), Daniel plans, develops and targets applications in the semiconductor industry that AM is uniquely suited to handle. He works closely with all of TI’s business units to mitigate issues both at the wafer and package level. Additionally, PERL functions as a research hub, coordinating internal, external and university research to expand and enable TI’s broad market share.